[산업] 中 시안에 12인치 낸드플래시 메모리 칩 2단계 프로젝트 장비 설치 시작...2021년 중반 가동 월 13만장 웨이퍼 생산 예정

evgeny2021.03.12
조회16

An employee works at the production line of Samsung China Semiconductor in Xi'an, capital of Northwest China's Shaanxi Province. Photo: Courtesy of Samsung

The 12-inch NAND flash memory chip phase II project of Samsung China Semiconductor Co in Xi'an, Northwest China's Shaanxi Province, entered equipment installation phase on Thursday.

The construction of the second phase of the project is expected to be completed and put into operation by mid-2021. When the second phase is fully operational, output is expected to reach 130,000 wafers per month, which will account for 40 percent of Samsung's global production of similar wafers, media reported.

 Samsung constructs phase-2 memory chip base in Xi'an, northwest China

[출처] [산업] 中 시안에 12인치 낸드플래시 메모리 칩 2단계 프로젝트 장비 설치 시작...2021년 중반 가동 월 13만장 웨이퍼 생산 예정|작성자 디스클로저